Entrance to building with a bicycle and blooming tulips

Kris Dorsey

PhD

Associate Professor

Physical Therapy, Human Movement, and Rehabilitation Sciences


Research Interests

Soft robotics, wearable devices, active and multifunctional materials, flexible electronics

Overview

Kris Dorsey is an associate professor in the Department of Electrical and Computer Engineering and the Department of Physical Therapy, Movement, and Rehabilitation Sciences in the Bouvé College of Health Sciences. Dr. Dorsey is also currently an MLK Visiting Associate Professor in the Media Lab at MIT, and previously was a President’s Postdoctoral Fellow at the University of California, Berkeley and the University of California, San Diego. Dr. Dorsey graduated from Carnegie Mellon University with a Ph.D. in Electrical and Computer Engineering and earned her Bachelors of Science in Electrical and Computer Engineering from Olin College. Dr. Dorsey’s current research interests include the design and fabrication of reconfigurable soft sensors for soft robots and wearable medical devices. In 2019, Dr. Dorsey was awarded an NSF CAREER grant.

Selected Publications

O.A. Araromi, M.A. Graule, K.L. Dorsey, S. Castellanos, J.R. Foster, W.H. Hsu, J.J. Vlassak, W.H. Hsu, A.E. Passy, J.J. Vlassak, J.C. Weaver, C.J. Walsh, R.J. Wood, “Ultra-sensitive and resilient compliant strain gauges for soft machines,” Nature, no. 587, pp. 219–224, 2020.

K.L. Dorsey, M. Cao*, G.A. Slipher, and N. Lazarus, “Mechanical isolation and temperature compensation in soft elastomer components,” IEEE J. Sensors, vol. 18, no. 18, 2018.

D.A. Rolfe, K.L. Dorsey, J.C. Cheng, and A.P. Pisano, “A surface acoustic resonator with template-patterned interdigitated fingers,” Sensors and Actuators A: Physical, vol. 248, 2016.

K.L. Dorsey and A.P. Pisano, “Stability and Control of a Metal Oxide Gas Sensor Under Air Flow,” IEEE J. Sensors, vol. 16, no. 3, 2016.

K.L. Dorsey, S.S. Bedair, and G.K. Fedder, “Gas chemical sensitivity of a CMOS MEMS cantilever functionalized by evaporative assembly,” J. Micromech. Microeng., vol. 24, no. 7, 2014